The year 2017 marked one of the biggest changes to iPhone in the form of a full-screen design that ditched Touch ID and brought Face ID. The next year’s iPhone launch could bring another landmark change in the form of a dual-SIM device.
According to KGI Securities’ analyst Ming-Chi Kuo (Via 9to5Mac), who is well-known in the world of iDevices, Apple could use Intel’s XMM 7560 and Qualcomm Snapdragon X20 modems. This would make way for dual-SIM capability on the device.
These choices will also bring a significant boost in the LTE speeds as they can deliver gigabit LTE speeds, which is equal to 1Gbps downlink. The new chips by Snapdragon and Intel will support 4×4 MIMO technology as compared to 2×2 MIMO technology of 2017 iPhones. Many Android flagships are already shipping with 4×4 MIMO technology.
Kuo’s report suggests that out of the three models predicted by him in an earlier report, at least one would come with dual-SIM dual standby and LTE+LTE connections. This is an exciting development as Apple is already working with Intel on 5G iPhone chips.
Kuo also believes that antenna will play a significant role in next year’s iPhone designs.
For those who don’t know, the earlier report predicted that Apple would launch two OLED iPhones with 6.5-inch and 5.8-inch screens. The third and cheaper model will feature 6.1-inch LCD screen. All three devices are expected to sport a full-screen, iPhone X-like design.